Dimensity 8000 Teased: Redmi K50, Realme GT Neo 3 Expected

Last Updated on December 19, 2021 by Anu Joy

MediaTek has teased its latest Dimensity 8000 chipset revealing some of its key aspects. It won’t be built on the 4nm process as its bigger sibling, the recently launched Dimensity 9000. Instead, it will utilize TSMC’s 5nm fabrication process. It will be a definite improvement over the Dimensity 1200’s 6nm node. But the MediaTek 8000 uses the older ARM v8 cores found on the Dimensity 1000 series instead of the latest ARM’s V9 cores. It will be an octa-core setup with 4 x A78 cores and 4 x A55 cores, which again is a step below the Dimensity 1200 SoC’s 1+3+4 CPU core configuration.

In the graphics department, MediaTek has chosen a newer ARM Mali G510 MC6 GPU with six cores. This, too, probably won’t match the ARM Mali-G77 MC9 GPU on the Dimensity 1000+ and the Dimensity 1200 chipsets.

Presumably, the Dimensity 8000 will be a mid-range smartphone chipset and could be slotted below the Dimensity 1200 SoC by the looks of it. MediaTek’s 8000 chipset looks a bit confusing on paper and it will be interesting to see how it fares in real-life usage. The jump to 5nm may make it an energy-efficient chipset in comparison but don’t expect it to set the synthetic benchmarks on fire. Its positioning could be somewhere around the 7 series of Snapdragon chipsets from Qualcomm.

Popular leakster, Digital Chat Station, posted on Weibo that the Realme GT Neo 3 and Redmi K50 vanilla variant may be equipped with the Dimensity 8000. The Redmi K50 Gaming is already confirmed to come with the flagship Dimensity 9000 SoC. Recently, major manufacturers Xiaomi, Oppo, Vivo, and Huawei announced their plans to launch Dimensity 9000 devices in 2022. Now, this leak suggests that Realme has also jumped the bandwagon to integrate one of the latest chipsets from MediaTek in its devices.