MediaTek Dimensity 1300 Chipset With 6nm Process, 5G Modem Announced For Affordable Flagship Phones: Specifications

Last Updated on March 2, 2022 by Asif Iqbal Shaik

MediaTek has seen tremendous growth in the last two years and has now become the leading chipmaker for both smartphones and Smart TVs. This has been made possible due to their low-cost 5G-ready solutions along with the recent flops from Qualcomm. Today, the company announced three new chips—the Dimensity 8000, Dimensity 8100, and the Dimensity 1300. We have already heard rumours about an upcoming OnePlus smartphone powered by the Dimensity 1300.

MediaTek Dimensity 1300 Specifications

The Dimensity 1300 is a successor to the already popular Dimensity 1200 SoC. It is built on TSMC’s 6nm process and has an eight-core CPU, including a 3GHz Cortex-A78 super-large core, three Cortex A-78 large cores, and four Cortex A-55 efficiency cores. This new chip also comes equipped with a 9-core Mali-G77 GPU, an APU 3.0, and the HyperEngine 5.0 game engine.

The Dimensity 1300 is an upper mid-range chip and hence loses on mmWave 5G connectivity. It does come with Wi-Fi 6 and Bluetooth 5.2 connectivity. The Dimensity 1300 still retains the AI chops of the Dimensity 1200 and boosts AI benchmark scores from the six-core APU 3.0 by up to 10 percent, giving greater capacity for AI tasks. It also gets the MediaTek APU 3.0 feature with an advanced multi-tasking scheduler to maximise performance and efficiency. The chip can support a 200MP camera, and we could see this on the upcoming 194MP phones.

Other features of the chip include support for up to 168Hz refresh rate displays, MediaTek 5G UltraSave power-saving enhancement suite, 2CC Carrier Aggregation (200MHz) across FDD+TDD, True Dual 5G SIM (5G SA + 5G SA), Dual VoNR, Enhanced HDR10+ video playback, AI camera modes and more. With these new chips, MediaTek is aiming for superiority in the mid-range and upper mid-range markets, and we will see these chips debut on smartphones starting this quarter.