AMD’s CEO, Dr. Lisa Su, presented the next generation of Ryzen processors during the AMD Keynote at Computex 2022. The Ryzen 7000 series, the successor to the popular Ryzen 5000 series, will have up to 16 Zen 4 cores. Moreover, it will be manufactured utilizing TSMC’s optimized 5nm process. The company exec also announced a new AM5 LGA1718 socket powering the X670E, X670, and B650 processors.
AMD Ryzen 7000 CPU Specifications
The Ryzen 7000 family, which uses the Zen 4 microarchitecture on an improved TSMC 5nm manufacturing process, is AMD’s next most popular processor. The Zen 4 is the first x86 desktop machine to employ 5nm, which had previously only been used in mobile CPUs. The Zen 4 will include 1MB of L2 cache per CPU core, which is double the amount seen in Zen 3 and Zen 2 CPU cores.
Because of the L2 cache enhancement and TSMC’s 5nm manufacturing process, this new generation is leagues ahead of earlier configurations. Officially, the Ryzen 7000 CPUs can run at 5GHz+ with the present arrangement. AMD managed to go above 5.5GHz in their Computex Demo, which is rather impressive considering the Ryzen 5000 series’ performance ratings.
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The pre-production Ryzen 7000 Series desktop processor outperformed an Intel Core i9 12900K CPU in a blender multi-threaded rendering test by 30 percent. A 6nm I/O die is included in the Ryzen 7000. The new I/O die has an AMD RDNA 2-based graphics engine, a new low-power design inspired by AMD Ryzen mobile processors, and support for up to four monitors, as well as DDR5 and PCI Express 5.0 connectivity technologies.
Additionally, AMD has stated that the Ryzen 7000 would have higher TDPs. While the brand has yet to announce official SKUs, it has stated that the new AM5 architecture allows for TDPs (CPU Package Power) of up to 170 Watts in this generation, up from the 105W TDPs of the AM4-based Ryzen 5000 series.
AMD AM5 Socket Platform
The AMD Ryzen 7000 CPU family will be the first to use AMD’s new AM5 architecture. This architecture will provide DDR5 and PCIe 5.0 functionality, as well as greater processor TDPs in the Ryzen 7000 family, by using an LGA-type socket with 1718 pins. AM5 can feature up to 24 PCIe 5.0 lanes, making it AMD’s fastest and most significant improvement to a desktop processor. However, unlike Intel, which supported both DDR5 and DDR4 with its Alder Lake platform last year, AMD is only offering DDR5 support.
A trio of new motherboard chipsets that will support the AM5 platform have also been announced—the X670E, X670, and B650. The X670E “Extreme” chipset is targeted at premium models and has support for two PCIe 5.0 graphics slots and at least one PCIe 5.0 M.2 storage slot. The X670, on the other hand, offers overclocking via PCIe 5.0 on one storage slot and optional graphics on the other. Overall, the X670E and X670 are aimed at enthusiasts and provide overclocking capabilities. AMD’s B650 chipset is a mass-market product aimed at a wide range of users.
All three motherboard chipsets are expected from partners such as Asrock, Asus, Biostar, Gigabyte, and MSI, as well as PCIe 5.0 storage options from Crucial, Micron, and Phison.
AMD Ryzen 7000 Processor Availability
AMD offered some specifics about the Ryzen 7000 CPUs and the AM5 platform at this year’s Computex. The official launch will take place this September. The company is expected to release further details on this new processor family in the coming months. The motherboards will most likely be released at the same time.