Infinix’s New 3D Vapour Cloud Chamber Reduces CPU Temperatures By 3°C Over Conventional Systems

Infinix has developed an improved vapour chamber cooling system that it calls “3D Vapour Cloud Chamber” (3D VCC). The company claims that it reduces the temperature of the chipset by 3°C when compared to conventional designs.

The brand achieves this feat by enhancing contact between the chipset and the vapour chamber itself. Due to the characteristic flatness of phone VCs, mating the chipset and VC needs the use of thermal paste or a similar substance. The condensed water is sent from the cool section of the phone back to the hot parts where it may evaporate again using a wick substance in vapour chambers, which are typically entirely passive components.

The regular flow of wicks was disturbed by the bump on Infinix’s VC chamber, so the company’s R&D team had to find out how to fix it. A complex capillary structure and a cutting-edge welding method were used as the answer. In order to properly cool down other regions of the chipset, the company is now striving to improve the VC Chamber design and make it thinner while also adding more bumps.

When this new VC chamber design will appear in the company’s smartphone range hasn’t been revealed yet.